New Approaches to Micro-electronic Component Cooling

By Xiangqi Wang

Over the past three decades, societal demands have resulted in extremely compact yet powerful electronic devices. Due to increased packaging density, improved performance of electronic devices has... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 3838314794
• ISBN13: 9783838314792
• Release Date: November 2009
• Publisher: LAP Lambert Academic Publishing
• Length: 304 Pages
• Weight: 0.99 lbs.
• Dimensions: 0.7" x 6.0" x 9.0"