More-Than-Moore Devices and Integration for Semiconductors

Book Overview

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems.

Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems;Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources;Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

• Format: Hardcover
• Language: English
• ISBN: 3031216091
• ISBN13: 9783031216091
• Release Date: February 2023
• Publisher: Springer
• Length: 260 Pages
• Weight: 1.24 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"