Modeling and Simulation of System In Package

by Alexey V. Petrushin

For the robust development of System in Package, increasing of the engineering efficiency and reducing costs, a careful electrical and thermo- mechanical design is found to be vital. The focus of this... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 3639259475
• ISBN13: 9783639259476
• Release Date: August 2010
• Publisher: VDM Verlag
• Length: 204 Pages
• Weight: 0.67 lbs.
• Dimensions: 0.5" x 6.0" x 9.0"