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Modeling and Simulation for Microelectronic Pac...

Edition Description

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily...

Edition Details

Format:Hardcover

Language:English

ISBN:0470827807

Format: Hardcover

Condition:

162.46

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Modeling and Simulation for Microelectronic Pac...

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