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Modeling and Application of Flexible Electronics Packaging
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Modeling and Application of Flexible Electronic... 9811336261 Book Cover

Modeling and Application of Flexible Electronic...

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Edition Description

Advanced Electronics Packaging.- Interfacial Modeling of Flexible Multilayer Structures.- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy.- Shear-Assisted Peeling.- Single-Needle Peeling.- Multi-Needle Peeling.- Conformal Peeling.- Laser Lift-Off.-...

Edition Details
Format:Hardcover
Language:English
ISBN:9811336261
Format: Hardcover
Condition:
$
109.99
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