Modeling and Application of Flexible Electronics Packaging

By Yongan Huang, Zhouping Yin, Xiaodong Wan

Advanced Electronics Packaging.- Interfacial Modeling of Flexible Multilayer Structures.- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy.- Shear-Assisted Peeling.- Single-Needle Peeling.- Multi-Needle Peeling.- Conformal Peeling.- Laser Lift-Off.- Vacuum-Based Picking-up and Placing-on.

• Format: Hardcover
• Language: English
• ISBN: 9811336261
• ISBN13: 9789811336263
• Release Date: May 2019
• Publisher: Springer
• Length: 287 Pages
• Weight: 1.34 lbs.
• Dimensions: 0.8" x 6.1" x 9.2"