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Computers & Technology Books > Computer Science Books > Microelectronics Packaging Handbook, Part III: Subsystem Packaging
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Microelectronics Packaging Handbook: Subsystem ... 0412084511 Book Cover

Microelectronics Packaging Handbook: Subsystem ...

By , ,
Edition Description

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a...

Edition Details
Format:Hardcover
Language:English
ISBN:0412084511
Format: Hardcover
Condition:
$
169.99
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