Microelectronic Packaging

By Madhav Datta, J. Walter Schultze, Tetsuya Osaka

This book explores the impact of electrochemical technologies on microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book considers chip wiring as a key aspect of microelectronic packaging and focuses on electrochemical processing as an enabler of advanced chip metallization. The book begins by outlining electrochemical processing, then discusses chip metallization topics. It explores chip-package interconnect technologies; analyzes packages, boards, and connectors; and concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.

• Format: Hardcover
• Language: English
• ISBN: 041531190X
• ISBN13: 9780415311908
• Release Date: December 2004
• Publisher: CRC Press
• Length: 564 Pages
• Weight: 2.01 lbs.
• Dimensions: 1.2" x 6.5" x 9.4"