Micro-Fluidic and Micro-electromechanical System Applications: Subtractive Processing of Glass Substrates

The reference text focuses on covering advanced manufacturing processes to fabricate microfluidic and micro-electromechanical system devices. It covers the fabrication of multiple hole arrays for interconnects, surface roughening of glass for microsystems packaging applications, and fabrication, and characterization of through-glass via for micro-electromechanical system packaging applications.

This book:

Presents an overview of subtractive technologies needed to process glass materials for micro-fluidic, and micro-electromechanical system applications Discusses the latest developments in advanced machining techniques based on mechanical energy, chemical energy, plasma energy, and high-temperature methods Covers post-processing techniques employed to facilitate the machined glass substrates for the micro-electromechanical system, micro-fluidic, and lab-on-chip applications Explains advanced techniques such as nonconventional machining processes, hybrid, and sequential machining methods to process glass Illustrates topics such as photoacoustic biosensing, cantilever beam temperature sensor, and parametric effect on machined micro-channels

It is primarily written for senior undergraduates, graduate students, and academic researchers in the fields of manufacturing engineering, industrial engineering, mechanical engineering, production engineering, materials science, and engineering.

• Format: Hardcover
• Language: English
• ISBN: 103274779X
• ISBN13: 9781032747798
• Release Date: March 2026
• Publisher: CRC Press
• Length: 286 Pages
• Weight: 1.31 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"