Materials Reliability in Microelectronics IX: Volume 563

By C.A. Volkert

The continual evolution of integrated circuit architecture places ever-increasing demands on the metal and dielectric thin films used in fabricating these circuits. Not only must these materials meet... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 155899470X
• ISBN13: 9781558994706
• Release Date: October 1999
• Publisher: Cambridge University Press
• Length: 311 Pages
• Weight: 1.41 lbs.
• Dimensions: 1.0" x 6.2" x 9.2"