Materials for Electronic Packaging

By Deborah Chung

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

• Format: Hardcover
• Language: English
• ISBN: 0750693142
• ISBN13: 9780750693141
• Release Date: April 1995
• Publisher: Butterworth-Heinemann
• Length: 368 Pages
• Weight: 1.63 lbs.
• Dimensions: 0.9" x 6.4" x 9.6"