Materials for Advanced Packaging

By C.P. Wong

Book Overview

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging. The book therefore provides readers with the most up-to-date developments in advanced packaging.

• Format: Hardcover
• Language: English
• ISBN: 0387782184
• ISBN13: 9780387782188
• Release Date: December 2008
• Publisher: Springer
• Length: 724 Pages
• Weight: 3.00 lbs.
• Dimensions: 1.7" x 6.5" x 9.8"