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Leistungsbewertung einer 3D-SRAM-Architektur mit koaxialem TSV
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Leistungsbewertung einer 3D-SRAM-Architektur mi... [German] 6209263763 Book Cover

Leistungsbewertung einer 3D-SRAM-Architektur mi... [German]

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Edition Description

Die 3D-Stapelung von Logik- und Speicherbausteinen ist unerl sslich, um das Moore'sche Gesetz aufrechtzuerhalten. Bei der 3D-Integration k nnen Speicherbausteine auf Prozessoren gestapelt werden. Die TSV-basierte 3D-Speicherarchitektur erm glicht die Wiederverwendung von Logik-Chips...

Edition Details
Format:Paperback
Language:German
ISBN:6209263763
Format: Paperback
Condition:
$
52.79
50 Available
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