Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces

By Qingke Zhang

Book Overview

Research Progress in Pb-free Soldering.- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface.- Tensile-compress Fatigue Behavior of Solder Joints.- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints.- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints.- Conclusions.

• Format: Paperback
• Language: English
• ISBN: 3662517256
• ISBN13: 9783662517253
• Release Date: August 2016
• Publisher: Springer
• Length: 143 Pages
• Weight: 0.51 lbs.
• Dimensions: 0.3" x 6.1" x 9.2"