Intermetallic Study Between Sn-AG-Cu-Zn Solders and Copper Substrate

by Ramani Mayappan

No Synopsis Available.

• Format: Paperback
• Language: English
• ISBN: 3845470011
• ISBN13: 9783845470016
• Release Date: September 2011
• Publisher: LAP Lambert Academic Publishing
• Length: 76 Pages
• Weight: 0.27 lbs.
• Dimensions: 0.2" x 6.0" x 9.0"