Interconnection of semiconductor devices in extreme environment microelectronic integrated circuit chips: United States Patent 9978686

By: Spry, David J.

A process of fabrication and the resulting integrated circuit device is made of patterned metal electrical interconnections between semiconductor devices residing on and forming extremely harsh environment integrated circuit chips. The process enables more complicated wide band gap semiconductor integrated circuits with more than one level of interconnect to function for prolonged time periods (over 1000 hours) at much higher temperatures (500 C).

• Format: Paperback
• Language: English
• ISBN: B08RGVST7B
• ISBN13: 9798584692339
• Release Date: January 1
• Publisher: Independently Published
• Length: 26 Pages
• Weight: 0.19 lbs.
• Dimensions: 0.1" x 8.5" x 11.0"