Harsh Environment Electronics: Interconnect Materials and Performance Assessment

By Ahmed Sharif

The book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. Chapters written by experts from academia and industry cover interconnect materials based on silver, gold and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials. The second main part of the book is devoted to the performance assessment of the different interconnect materials and their respective environmental impact.

• Format: Hardcover
• Language: English
• ISBN: 3527344195
• ISBN13: 9783527344192
• Release Date: August 2019
• Publisher: Wiley-Vch
• Length: 400 Pages
• Weight: 2.05 lbs.
• Dimensions: 1.5" x 6.7" x 9.8"