Interaction of Sn-9zn and Sn-8zn-3bi Lead-Free on Copper Metallization

By Ramani Mayappan

Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Emerging environmental regulations worldwide have targeted the elimination of Pb usage in... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 3838384520
• ISBN13: 9783838384528
• Release Date: August 2010
• Publisher: LAP Lambert Academic Publishing
• Length: 192 Pages
• Weight: 0.64 lbs.
• Dimensions: 0.4" x 6.0" x 9.0"