Hybrid Assemblies and Multichip Modules

By Fred W. Kear

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.

• Format: Hardcover
• Language: English
• ISBN: 0824784669
• ISBN13: 9780824784669
• Release Date: December 1992
• Publisher: CRC Press
• Length: 296 Pages
• Weight: 1.60 lbs.
• Dimensions: 1.0" x 6.4" x 9.2"