Handbook of Wafer Bonding

By Maaike M.V. Taklo, James Jian-Qiang Lu, Peter Ramm

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

• Format: Hardcover
• Language: English
• ISBN: 3527326464
• ISBN13: 9783527326464
• Release Date: February 2012
• Publisher: Wiley-Vch
• Length: 425 Pages
• Weight: 2.00 lbs.
• Dimensions: 0.9" x 6.9" x 9.7"