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Foldable Flex and Thinned Silicon Multichip Pac...
Edition Description
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It...
Edition Details
Format:Hardcover
Language:English
ISBN:0792376765
Format: Hardcover
Condition:
$
169.99
Foldable Flex and Thinned Silicon Multichip Pac...
Edition Description
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It...
Edition Details
Format:Paperback
Language:English
ISBN:146134977X
Format: Paperback
Condition:
$
169.99
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