Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

By Yiu-Wing Mai, E.H. Wong, Y.-W. Mai

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 1845695283
• ISBN13: 9781845695286
• Release Date: June 2015
• Publisher: Woodhead Publishing
• Length: 482 Pages
• Weight: 1.98 lbs.
• Dimensions: 1.2" x 6.1" x 9.1"