Elements of Electromigration: Electromigration in 3D IC technology

By King-Ning Tu and Yingxia Liu

Book Overview

In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.

• Format: Paperback
• Language: English
• ISBN: 1032470283
• ISBN13: 9781032470283
• Release Date: December 2025
• Publisher: CRC Press
• Length: 132 Pages
• Weight: 0.53 lbs.
• Dimensions: 0.3" x 6.7" x 9.6"