Electronic Packaging for High Reliability, Low Cost Electronics

By Rao R. Tummala, Darko Belavic, Marija Kosec, et al.

Book Overview

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0792352181
• ISBN13: 9780792352181
• Release Date: February 2000
• Publisher: Springer
• Length: 296 Pages
• Weight: 1.35 lbs.
• Dimensions: 0.8" x 6.1" x 9.2"