An element body includes a first principal surface and a second principal surface opposing each other in a first direction. A first terminal electrode is disposed on the first principal surface side of the element body. A second terminal electrode is disposed on the second principal surface side of the element body. The first terminal electrode includes a first sintered metal layer formed on the first principal surface; and a first plating layer formed on the first sintered metal layer and including base metal. The second terminal electrode includes a second sintered metal layer formed on the second principal surface, a second plating layer formed on the second sintered metal layer and including base metal, and a solder layer formed on the second plating layer and including Sn and a metal having a higher melting point than the melting point of Sn.
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