Electromigration in Thin Films and Electronic Devices: Materials and Reliability

By: Kim, Choong-Un

Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. "Electromigration in Thin Films and Electronic Devices" provides an up-to-date review of key topics in this commercially important area.

• Format: Paperback
• Language: English
• ISBN: 0081016964
• ISBN13: 9780081016961
• Release Date: September 2016
• Publisher: Woodhead Publishing
• Length: 352 Pages
• Weight: 1.09 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"