Electromigration in Cu Interconnects

By Dr. Arijit Roy

This work is intended for the beginners and the advanced readers. Electromigration is VLSI/ULSI interconnection remains one of the major failure issues in microelectronics and electromigration remains... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 3845412925
• ISBN13: 9783845412924
• Release Date: July 2011
• Publisher: LAP Lambert Academic Publishing
• Length: 144 Pages
• Weight: 0.49 lbs.
• Dimensions: 0.3" x 6.0" x 9.0"