Electrical Design of Through Silicon Via

By Joungho Kim and Jun So Pak

Book Overview

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

• Format: Hardcover
• Language: English
• ISBN: 940179037X
• ISBN13: 9789401790376
• Release Date: May 2014
• Publisher: Springer
• Length: 280 Pages
• Weight: 1.29 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"