Design and Modeling for 3D ICS and Interposers

By Madhavan Swaminathan, Ki Jin Han, Ki Jin Han

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 9814508594
• ISBN13: 9789814508599
• Release Date: January 2014
• Publisher: World Scientific Publishing Company
• Length: 380 Pages
• Weight: 1.45 lbs.
• Dimensions: 1.0" x 6.0" x 9.0"