Design and Application of Intelligent Thermally Conductive Materials

By Feng Wei PhD

Design and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design, and application of these newly developed materials in various contexts, together with an analysis of future trends and applications. The author presents a detailed description of the application of these intelligent materials to a wide range of uses, and also of their particular importance in the development and application of advanced chips. It provides postgraduates and senior undergraduates with an essential overview of thermal conductivity, from which to appreciate the descriptions of intelligent thermal conductivity.

For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.

• Format: Paperback
• Language: English
• ISBN: 0443404097
• ISBN13: 9780443404092
• Release Date: June 2025
• Publisher: Elsevier
• Length: 374 Pages
• Weight: 0.62 lbs.
• Dimensions: 0.3" x 6.3" x 9.0"