Design a Slit HDP Semiconductor Plasma Dry Etcher

by Kung Linliu

In order to overcome the difficulties of the manufacturing procedures, the novel concept of slit shape HDP plasma dry etching of metal roller from semiconductor IC process is proposed and applied to a patent.

• Format: Paperback
• Language: English
• ISBN: B08MX125WP
• ISBN13: 9798561298431
• Release Date: November 2020
• Publisher: Independently Published
• Length: 140 Pages
• Weight: 0.43 lbs.
• Dimensions: 0.3" x 6.0" x 9.0"