Skip to content
Menu Button
Scan a barcode
Scan
My Lists
Menu Button
Scan a barcode
Scan
Join the 2026 ThriftBooks Reading Challenge!
Set your goal →
Hardcover Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration Book
Share to Facebook
Share to Pinterest
Share to Twitter

ISBN: 9819568900

ISBN13: 9789819568901

Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration

By and
No Customer Reviews
No Synopsis Available.

Recommended

Format: Hardcover

$219.99
Releases 4/15/2026
Save to List

Related Subjects

Engineering Science Science & Math Science & Scientists Science & Technology Technology

Customer Reviews

0 rating
Write a review
Trustpilot

Popular Categories

Website

My Account

Partnerships

Quick Help

About Us

ThriftBooks sells millions of used books at the lowest everyday prices. We personally assess every book's quality and offer rare, out-of-print treasures. We deliver the joy of reading in recyclable packaging with free standard shipping on US orders over $15. ThriftBooks.com. Read more. Spend less.

Follow Us

Link to Facebook
Link to Twitter
Link to Pinterest
Link to Tumblr
Link to Instagram
Copyright © 2026 Thriftbooks.com Terms of Use | Privacy Policy | Do Not Sell/Share My Personal Information | Cookie Policy | Cookie Preferences | Accessibility Statement
ThriftBooks® and the ThriftBooks® logo are registered trademarks of Thrift Books Global, LLC
GoDaddy Verified and Secured