Creep and Stress Relaxation in Miniature Structures and Components

This collection of papers, from the symposium held during Materials Week 96 in Cincinnati, Ohio, October 7-10, 1996, deals with creep, stress relaxation and time-dependent deformation of miniature structures (films, foils, fibres, solder bumps) and their components (metals and polymers). It is recognized that the mechanical properties of small-scaled samples tend to differ from those of bulk materials of identical composition. The long-term deformation, with ultimate rupture or failure, becomes a serious reliability hazard. These two aspects - properties and performance - are examined in depth.

• Format: Hardcover
• Language: English
• ISBN: 0873393732
• ISBN13: 9780873393737
• Release Date: January 1997
• Publisher: Tms
• Weight: 1.30 lbs.
• Dimensions: 9.5" x 1.0" x 6.5"