Copper Diffusion Barriers

By Seemant Rawal

As device dimensions shrink, there is an urgent need to replace conventionally used aluminum interconnects to achieve increased current density requirements and better performance at future technology... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 3639310446
• ISBN13: 9783639310443
• Release Date: November 2010
• Publisher: VDM Verlag
• Length: 136 Pages
• Weight: 0.46 lbs.
• Dimensions: 0.3" x 6.0" x 9.0"