CMOS Plasma and Process Damage

By Kirk Prall

This book discusses the complex technology of building CMOS computer chips and covers some of the unusual problems that can occur during chip manufacturing. Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems.

• Format: Hardcover
• Language: English
• ISBN: 3031890280
• ISBN13: 9783031890284
• Release Date: May 2025
• Publisher: Springer
• Length: 466 Pages
• Weight: 1.89 lbs.
• Dimensions: 1.1" x 6.1" x 9.2"