Chiplet-Based System-on-a-Chip (SoC) Architecture: Future of Advanced Computing

By Prakash Rashinkar

Moore's Law is reaching its limits. Chiplets are the future. For decades, scaling meant cramming more transistors onto a single die. But rising costs, yield challenges, and power constraints are forcing a shift. The industry's biggest players--AMD, Intel, NVIDIA, and Apple--are already moving to chiplet-based architectures. If you want to stay ahead, you need to understand why this shift is happening, what changes, and how to design for it. This book delivers a clear, practical overview to chiplet-based SoC architecture--covering partitioning strategies, die-to-die interconnects, power and thermal challenges, security risks, and cost tradeoffs. Whether you're designing these systems, making strategic decisions, or preparing for the next step in your career, this book gives you the insights to lead the conversation and stay competitive in the next era of computing. What's inside the book: Why the industry is shifting to chiplets - The limitations of monolithic scaling, the economic drivers, and the technical challenges pushing companies toward modular architectures. Key architectural differences - How compute, memory, and I/O functions are partitioned across chiplets, and why this changes system design. Die-to-die interconnects - A breakdown of standards like UCIe, BoW, AIB, and Infinity Fabric, and their impact on performance, bandwidth, and latency. Security challenges - New attack surfaces in multi-die systems, and strategies for securing firmware, interconnects, and cryptographic integrity. Software stack evolution - Adaptations in the hardware abstraction layer, memory management, and inter-chiplet communication--with deep dives into debugging, performance tuning, and firmware coordination across dies. Packaging innovations - How 2.5D, 3D, and hybrid bonding enable chiplet integration, and the real-world trade-offs of each approach. Power, thermal, and cost considerations - Strategies for optimizing energy efficiency, managing heat dissipation, and balancing yield with manufacturing complexity. Real-world case studies - How industry leaders are deploying chiplets in HPC, AI acceleration, gaming, and automotive ADAS systems. Get real, practical knowledge to make informed decisions, whether you're a tech lead or system architect building chiplets, engineering manager or executive strategizing your company's roadmap, or a new graduate joining the semiconductor industry.

• Format: Hardcover
• Language: English
• ISBN: B0F4PWR639
• ISBN13: 9798317291006
• Release Date: April 2025
• Publisher: Independently published
• Length: 370 Pages
• Dimensions: 9.0" x 1.1" x 6.0"