Chemical-Mechanical Polishing 2000 Fundamentals and Materials Issues: Volume 613

Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 1107413141
• ISBN13: 9781107413146
• Release Date: June 2014
• Publisher: Cambridge University Press
• Length: 176 Pages
• Weight: 0.54 lbs.
• Dimensions: 0.4" x 6.0" x 9.0"