Cae/CAD and Thermal Management Issues in Electronic Packaging

by D. Agonafer, American Society of Mechanical Engineers, Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta

Proceedings of the November 1997 symposium. Twelve papers relate to the use of computer simulations to solve complex packaging problems related to thermo/mechanical problems. Topics include improving electronic packaging manufacturing through product and process-driven analysis; thermo-mechanical an

• Format: Paperback
• Language: English
• ISBN: 0791818527
• ISBN13: 9780791818527
• Release Date: January 1997
• Publisher: American Society of Mechanical Engineers
• Length: 109 Pages