CAE - CAD & Thermal Management Issues in Electronic Systems: Proceedings, Asme International Mechanical Engineering Congress & Exposition, Dallas, Tx. 1997 (Eep Htd Series Volumes 23 and 356)

By D. Agonafer, American Society of Mechanical Engineers, Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta

Proceedings of the November 1997 symposium. Twelve papers relate to the use of computer simulations to solve complex packaging problems related to thermo/mechanical problems. Topics include improving electronic packaging manufacturing through product and process-driven analysis; thermo-mechanical an

• Format: Paperback
• Language: English
• ISBN: 0791818527
• ISBN13: 9780791818527
• Release Date: January 1997
• Publisher: Amer Society of Mechanical
• Length: 109 Pages
• Weight: 1.74 lbs.