Bonding clamps used to assembly photovoltaic (PV) arrays and provide an electrical bond between PV module frames forming part of the PV arrays is provided. The bonding clamp includes an electrically conductive body, at least one electrical bonding member extending from the body, and at least one pressure member extending from the body. The bonding clamp may also include one or more spacers to provide a uniform spacing between PV module frames.
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