There are many benefits to using the BGA package; however, its greatest asset, the ability to provide an extremely dense array of thousands of pins, also turns out to be a tremendous problem for PCB designers.The BGA density and pin count continues to increase; yet, our ability to effectively design with these devices has not kept pace. Fortunately, significant advancements in PCB fabrication technology have enabled further miniaturization in the manufacturing process. These improvements, along with new software and design methods specifically for BGAs provide a means to successfully design using these devices.This book explores the impact of dense BGAs with high pin-count on PCB design and provides solutins for inherent design challenges and is for PCB designers who are designing boards with multiple very large BGAs.
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