This book is for PCB designers who are designing boards with multiple verylarge Ball Grid Array (BGA) packages. It explores the impact of dense BGAswith high pin-count on PCB design and provides solutions for the inherentdesign challenges. Though you may not yet have been confronted with thedifficulties of routing BGAs and the impact on fabrication costs and signalintegrity, this book will reveal these potential pitfalls as well as methods tomitigate these problems.
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