Area Array Packaging Processes

By Ken Gilleo

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 0071738010
• ISBN13: 9780071738019
• Release Date: October 2003
• Publisher: McGraw-Hill
• Length: 272 Pages
• Weight: 1.04 lbs.
• Dimensions: 0.6" x 7.5" x 9.3"