Area Array Packaging Materials

By Ken Gilleo

Book Overview

Area array packaging requires particular solder pastes and fluxes. With many countries now requiring that electronic systems be manufactured with lead-free solder, the assembly of high density... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 0071738002
• ISBN13: 9780071738002
• Release Date: October 2003
• Publisher: McGraw-Hill
• Length: 176 Pages
• Weight: 0.69 lbs.
• Dimensions: 0.4" x 7.5" x 9.3"