Area Array Package Design

By Ken Gilleo

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 0071737731
• ISBN13: 9780071737739
• Release Date: October 2003
• Publisher: McGraw-Hill
• Length: 220 Pages
• Weight: 0.85 lbs.
• Dimensions: 0.5" x 7.5" x 9.3"