Area Array Package Design: Techniques in High Density Electronics

by Ken Gilleo

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0071428275
• ISBN13: 9780071428279
• Release Date: October 2003
• Publisher: McGraw-Hill Professional Publishing
• Length: 204 Pages
• Weight: 1.30 lbs.
• Dimensions: 0.9" x 7.5" x 9.6"