An Introduction to Bonding for Electronic Facilities

By J. Paul Guyer

Introductory technical guidance for electrical engineers and construction managers interested in bonding in buildings housing electronic equipment such as computer rooms, data processing facilities and communications equipment. Here is what is discussed:1. DEFINITION OF BONDING2. PURPOSES OF BONDING3. RESISTANCE CRITERIA4. DIRECT BONDS5. INDIRECT BONDS6. SURFACE PREPARATION7. COMPLETION OF THE BOND8. BOND CORROSION9. WORKMANSHIP10. SUMMARY OF GUIDELINES.

• Format: Paperback
• Language: English
• ISBN: 1085970736
• ISBN13: 9781085970730
• Release Date: July 2019
• Publisher: Independently Published
• Length: 56 Pages
• Weight: 0.34 lbs.
• Dimensions: 0.1" x 8.5" x 11.0"