Advances and Challenges in Chemical Mechanical Planarization: Volume 991

By Gerfried Zwicker, G. Zwicker, L. Economikos, et al.

Chemical mechanical planarization (CMP) has been a leading-edge technology in semiconductor processing for the past 15-20 years. A successful CMP process is based in fundamental science across the... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 1558999515
• ISBN13: 9781558999510
• Release Date: November 2007
• Publisher: Cambridge University Press
• Length: 371 Pages
• Weight: 1.41 lbs.
• Dimensions: 1.0" x 6.2" x 9.2"