Advanced Thermal Stress Analysis of Smart Materials and Structures

By Zengtao Chen and Hamid Akbarzadeh

Book Overview

Heat conduction and moisture diffusion theories.- Basic Problems of Non-Fourier Heat Conduction.- Multiphysics of smart materials and structures.- Coupled thermal stresses in advanced and smart materials.- Thermal Fracture of Advanced Materials based on Fourier Heat Conduction.- Advanced thermal fracture analysis based on non-Fourier heat conduction models.- Future Perspectives.

• Format: Paperback
• Language: English
• ISBN: 3030252035
• ISBN13: 9783030252038
• Release Date: September 2020
• Publisher: Springer
• Length: 304 Pages
• Weight: 0.98 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"