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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test
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Advanced Semiconductor Packaging Handbook: Chip... B0HC9J2DQN Book Cover

Advanced Semiconductor Packaging Handbook: Chip...

Edition Description

For most of its history, packaging was the last stop on a chip's journey to market - a protective shell added after the real engineering was finished. That framing no longer holds. As transistor scaling has slowed, the package itself has become one of the most powerful remaining...

Edition Details
Format:Paperback
Language:English
ISBN:B0HC9J2DQN
Format: Paperback
Condition:
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